Application of Mission Profiles to enable cross-domain constraint-driven design

Author

Katzschke, C. ; Sohn, M.-P. ; Olbrich, Markus ; Meyer zu Bexten, V. ; Tristl, M. ; Barke, Erich

Author_Institution

Inst. of Microelectron. Syst., Leibniz Univ. Hannover, Hannover, Germany

fYear

2014

fDate

24-28 March 2014

Firstpage

1

Lastpage

6

Abstract

Mission Profiles contain top-level stress information for the design of future systems. These profiles are refined and transformed to design constraints. We present methods to propagate the constraints between design domains like package and chip. We also introduce a cross-domain methodology for our corresponding constraint transformation system ConDUCT. The proposed methods are demonstrated on the basis of an automotive analog/mixed-signal application.

Keywords

automotive electronics; integrated circuit design; mixed analogue-digital integrated circuits; stress analysis; ConDUCT constraint transformation system; automotive analog-mixed-signal application; cross-domain constraint-driven design; cross-domain methodology; design constraint; design domain; mission profiles; top-level stress information; Chip scale packaging; Conductors; Current density; Integrated circuits; Petri nets; Stress; Vehicles; Mission Profiles and constraints; constraint transformation; constraints in integrated circuits; cross-domain constraints;

fLanguage

English

Publisher

ieee

Conference_Titel

Design, Automation and Test in Europe Conference and Exhibition (DATE), 2014

Conference_Location

Dresden

Type

conf

DOI

10.7873/DATE.2014.079

Filename

6800280