• DocumentCode
    129034
  • Title

    Temperature aware energy-reliability trade-offs for mapping of throughput-constrained applications on multimedia MPSoCs

  • Author

    Das, Aruneema ; Kumar, Ajit ; Veeravalli, Bharadwaj

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Nat. Univ. of Singapore, Singapore, Singapore
  • fYear
    2014
  • fDate
    24-28 March 2014
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    This paper proposes a design-time (offline) analysis technique to determine application task mapping and scheduling on a multiprocessor system and the voltage and frequency levels of all cores (offline DVFS) that minimize application computation and communication energy, simultaneously minimizing processor aging. The proposed technique incorporates (1) the effect of the voltage and frequency on the temperature of a core; (2) the effect of neighboring cores´ voltage and frequency on the temperature (spatial effect); (3) pipelined execution and cyclic dependencies among tasks; and (4) the communication energy component which often constitutes a significant fraction of the total energy for multimedia applications. The temperature model proposed here can be easily integrated in the design space exploration for multiprocessor systems. Experiments conducted with MPEG-4 decoder on a real system demonstrate that the temperature using the proposed model is within 5% of the actual temperature clearly demonstrating its accuracy. Further, the overall optimization technique achieves 40% savings in energy consumption with 6% increase in system lifetime.
  • Keywords
    integrated circuit reliability; multimedia communication; optimisation; system-on-chip; MPEG-4 decoder; application task mapping; communication energy component; cyclic dependencies; design space exploration; design-time analysis technique; energy consumption; frequency levels; multimedia MPSoC; multiprocessor systems-on-chip; offline DVFS; offline analysis technique; optimization technique; pipelined execution; processor aging minimization; spatial effect; temperature aware energy-reliability trade-offs; temperature model; throughput-constrained application mapping; voltage levels; Equations; Mathematical model; Multimedia communication; Reliability; Temperature dependence; Temperature sensors; Throughput;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design, Automation and Test in Europe Conference and Exhibition (DATE), 2014
  • Conference_Location
    Dresden
  • Type

    conf

  • DOI
    10.7873/DATE.2014.115
  • Filename
    6800316