Modeling and experimental verification of the interconnected mesh power system (IMPS) MCM topology

Author

Low, Yee L. ; Schaper, Leonard W. ; Ang, Simon S.

Author_Institution

Lucent Technologies, AT&T Bell Labs., Murray Hill, NJ, USA

Volume

20

Issue

1

fYear

1997

fDate

2/1/1997 12:00:00 AM

Firstpage

42

Lastpage

49

Abstract

A new low-cost multichip module (MCM) topology, the interconnected mesh power system (IMPS), has been shown capable of reducing the metal layers of a conventional four-layer MCM by half. To provide a complete MCM on only two metal layers, the IMPS topology provides a unique and complex power distribution system and signal transmission environment. This paper reports on models of the IMPS structure based on finite-difference/partial-inductance methods and PSpice simulation. The models can easily he constructed using a commercial three-dimensional (3-D) field solver and the circuit models can be solved by PSpice. The agreement between the modeled and measured results is excellent. Discrepancies between models and results are also discussed

Keywords

SPICE; finite difference methods; multichip modules; network topology; IMPS MCM topology; Spice simulation; circuit model; finite-difference/partial-inductance method; interconnected mesh power system; metal layer; power distribution; signal transmission; three-dimensional field solver; Circuit simulation; Circuit topology; Electromagnetic modeling; Finite difference methods; Integrated circuit interconnections; Multichip modules; Power distribution; Power system interconnection; Power system modeling; Signal design;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1070-9894

Type

jour

DOI

10.1109/96.554524

Filename

554524