• DocumentCode
    1294962
  • Title

    On the design of coplanar bond wires as transmission lines

  • Author

    Goossen, K.W.

  • Author_Institution
    Bell Labs., Lucent Technol., Holmdel, NJ, USA
  • Volume
    9
  • Issue
    12
  • fYear
    1999
  • fDate
    12/1/1999 12:00:00 AM
  • Firstpage
    511
  • Lastpage
    513
  • Abstract
    Bond wires are typically thought of as lumped electrical parasitic elements, and the usual design methodology is to make them as short as possible. Here, another scenario is shown where the bond wires may be thought of as transmission lines. Specifically, the practical system of “coplanar waveguide wires” is analyzed. If parameters are chosen carefully, especially with regard to wire height above substrate, they may impedance match the microstrip connector
  • Keywords
    coplanar transmission lines; impedance matching; lead bonding; microwave devices; packaging; transmission line theory; CPW wires; coplanar bond wire design; coplanar waveguide wires; impedance matching; microwave package; transmission lines; wire height above substrate; Bonding; Coaxial components; Connectors; Coplanar transmission lines; Dielectric substrates; Impedance; Microstrip; Packaging; Transmission lines; Wires;
  • fLanguage
    English
  • Journal_Title
    Microwave and Guided Wave Letters, IEEE
  • Publisher
    ieee
  • ISSN
    1051-8207
  • Type

    jour

  • DOI
    10.1109/75.819415
  • Filename
    819415