DocumentCode
1294962
Title
On the design of coplanar bond wires as transmission lines
Author
Goossen, K.W.
Author_Institution
Bell Labs., Lucent Technol., Holmdel, NJ, USA
Volume
9
Issue
12
fYear
1999
fDate
12/1/1999 12:00:00 AM
Firstpage
511
Lastpage
513
Abstract
Bond wires are typically thought of as lumped electrical parasitic elements, and the usual design methodology is to make them as short as possible. Here, another scenario is shown where the bond wires may be thought of as transmission lines. Specifically, the practical system of “coplanar waveguide wires” is analyzed. If parameters are chosen carefully, especially with regard to wire height above substrate, they may impedance match the microstrip connector
Keywords
coplanar transmission lines; impedance matching; lead bonding; microwave devices; packaging; transmission line theory; CPW wires; coplanar bond wire design; coplanar waveguide wires; impedance matching; microwave package; transmission lines; wire height above substrate; Bonding; Coaxial components; Connectors; Coplanar transmission lines; Dielectric substrates; Impedance; Microstrip; Packaging; Transmission lines; Wires;
fLanguage
English
Journal_Title
Microwave and Guided Wave Letters, IEEE
Publisher
ieee
ISSN
1051-8207
Type
jour
DOI
10.1109/75.819415
Filename
819415
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