Metal layer planning for silicon interposers with consideration of routability and manufacturing cost

A 2.5D IC provides a silicon interposer to integrate multiple dies into a package, which not only offers better performance than 2D ICs but also has lower manufacturing complexity than true 3D ICs. In an interposer, routing wires connect signals between dies or route signals from dies to the package substrate. The number of metal layers in an interposer is one of the critical factors to affect the routability and manufacturing cost of the 2.5D IC. Thus, how to achieve 100% routing completion rate in an interposer using a minimum number of metal layers plays a key role for the success of a 2.5D IC. This paper presents a global-routing-based metal layer planner called VGR to identify a minimal number of metal layers for an interposer with consideration of routability and manufacturing cost. Also, VGR can identify a good stacking order of the horizontal and vertical layers in an interposer such that the routing solution in the interposer costs fewer vias. To our best knowledge, this paper is the first study to solve the metal layer planning problem for silicon interposers.