• DocumentCode
    1299553
  • Title

    Experimental Verification of Scan-Architecture-Based Evaluation Technique of SET and SEU Soft-Error Rates at Each Flip-Flop in Logic VLSI Systems

  • Author

    Yanagawa, Y. ; Kobayashi, D. ; Hirose, K. ; Makino, T. ; Saito, H. ; Ikeda, H. ; Onoda, S. ; Hirao, T. ; Ohshima, T.

  • Author_Institution
    Dept. of Electron. Eng., Univ. of Tokyo, Tokyo, Japan
  • Volume
    56
  • Issue
    4
  • fYear
    2009
  • Firstpage
    1958
  • Lastpage
    1963
  • Abstract
    Irradiation test results demonstrate the validity of a scan FF technology for separately evaluating SET and SEU soft error rates (SERs) in logic VLSI systems. The SET and SEU soft errors mean the upset caused by latching an SET pulse that originates in combinational logic cell blocks and the upset caused by a direct ion hit to the FF, respectively. A test chip is fabricated using a 0.2-mum fully-depleted silicon-on-insulator standard cell library and irradiated under an LET of 40 MeV-cm2/mg. The SET and SEU soft error rates are successfully measured by the scan FFs on the test chip. A theoretical SET SER estimation from measured SET-pulse widths is also experimentally validated.
  • Keywords
    VLSI; flip-flops; integrated circuit measurement; integrated logic circuits; radiation effects; silicon-on-insulator; SET soft-error rates; SEU soft-error rates; combinational logic cell blocks; flip-flop; fully-depleted silicon-on-insulator standard cell library; irradiation test; logic VLSI systems; scan-architecture-based evaluation technique; size 0.2 mum; test chip; Circuit testing; Error analysis; Extraterrestrial measurements; Flip-flops; Integrated circuit measurements; Logic testing; Semiconductor device measurement; Single event upset; System testing; Very large scale integration; Irradiation test; integrated circuit radiation effects; logic VLSI system; scan architecture; single event transient; single event upset;
  • fLanguage
    English
  • Journal_Title
    Nuclear Science, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9499
  • Type

    jour

  • DOI
    10.1109/TNS.2009.2020166
  • Filename
    5204655