• DocumentCode
    1306806
  • Title

    Circuit simulation and modeling

  • Author

    Yang, Ping

  • Author_Institution
    Semiconductor Process and Design Center, Texas Instruments, Inc. MS 369, P.O. Box 655621, 12840 Hillcrest Plaza, Dallas, TX 75265
  • Volume
    3
  • Issue
    6
  • fYear
    1987
  • Firstpage
    34
  • Lastpage
    38
  • Abstract
    This editor´s column includes the readers´ comments and questions, as well as any other short material on simulation and modeling. In the following, abbreviated versions of the correspondences I have received are presented, and answers are provided wherever possible. For questions I donot know the answers to, I will forward to experts in that field and also would like to encourage readers to send in their answers.
  • fLanguage
    English
  • Journal_Title
    Circuits and Devices Magazine, IEEE
  • Publisher
    ieee
  • ISSN
    8755-3996
  • Type

    jour

  • DOI
    10.1109/MCD.1987.6323179
  • Filename
    6323179
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1306806