• DocumentCode
    1307067
  • Title

    Radial yield variations in semiconductor wafers

  • Author

    Ferris-Prabhu, Albert V. ; Smith, Larry D. ; Bonges, Henry A. ; Paulsen, James K.

  • Author_Institution
    IBM, Essex Junction, VT, USA
  • Volume
    3
  • Issue
    2
  • fYear
    1987
  • fDate
    3/1/1987 12:00:00 AM
  • Firstpage
    42
  • Lastpage
    47
  • Abstract
    Detailed examination of yield data from several different products in two different technologies and two different wafer sizes has shown a pronounced radial dependence. In all cases, the yield profile has a distinct knee starting at about 10 mm from the wafer periphery, dropping steeply within the final 5 mm. The similarity in yield profile near the periphery across all the products examined suggests that edge yield loss is of a gross nature and is not caused by design, technology, wafer size, or random defects.
  • fLanguage
    English
  • Journal_Title
    Circuits and Devices Magazine, IEEE
  • Publisher
    ieee
  • ISSN
    8755-3996
  • Type

    jour

  • DOI
    10.1109/MCD.1987.6323237
  • Filename
    6323237
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1307067