• DocumentCode
    1314083
  • Title

    Latency Insertion Method (LIM) for DC Analysis of Power Supply Networks

  • Author

    Klokotov, Dmitri ; Goh, Patrick ; Schutt-Ainé, José E.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Illinois at Urbana-Champaign, Urbana, IL, USA
  • Volume
    1
  • Issue
    11
  • fYear
    2011
  • Firstpage
    1839
  • Lastpage
    1845
  • Abstract
    Process scaling in modern integrated circuits has led to multiple signal and power integrity issues. In particular, ensuring reliable performance of on-chip power delivery systems has become a major design challenge. Rigorous analysis and simulations are required at the design stage to ensure proper functionality of an on-chip power supply. This puts a strain on existing numerical tools due to the sheer size of the power grids. In this paper, a fast circuit simulation technique based on the latency insertion method (LIM) is proposed for the steady-state analysis of large-scale circuits, such as on-chip power distribution network. The proposed method is shown to be very efficient for modeling of networks with very large numbers of nodes. The comparison with one of the well-established methods used for the power grid analysis today, the Random-Walk algorithm, shows that LIM is almost two orders of magnitude faster.
  • Keywords
    circuit simulation; distribution networks; power grids; power supply circuits; DC analysis; circuit simulation; large-scale circuit; latency insertion method; modern integrated circuit; on-chip power delivery system; on-chip power distribution network; power grid analysis; power supply network; process scaling; random-walk algorithm; steady-state analysis; Computational modeling; Integrated circuit modeling; Mathematical model; Power grids; Steady-state; Transient analysis; DC analysis; IR-drop; latency insertion; latency insertion method; power distribution network; power integrity; power supply;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    2156-3950
  • Type

    jour

  • DOI
    10.1109/TCPMT.2011.2162838
  • Filename
    6009178