DocumentCode
1315151
Title
Impact Testing of Plug-In Circuit Packages for High Reliability
Author
Kohl, R.C. ; Wadsworth, D.J.
Author_Institution
Bell Telephone Laboratories, Inc., Holmdel, N. J.
Issue
2
fYear
1965
Firstpage
114
Lastpage
119
Abstract
A mechanical impact test has been used to improve the production reliability of plugin circuit packages for a Bell System electronic switching system. Mechanically unstable components which could cause intermittent electrical failures in system operation are located by monitoring the electrical output of the package during the test.
Keywords
Acoustic testing; Circuit testing; Electric shock; Electronic equipment testing; Electronics packaging; Logic circuits; Logic testing; Production systems; Switching systems; System testing;
fLanguage
English
Journal_Title
Reliability, IEEE Transactions on
Publisher
ieee
ISSN
0018-9529
Type
jour
DOI
10.1109/TR.1965.5214886
Filename
5214886
Link To Document