• DocumentCode
    1318788
  • Title

    Decorrelated Feature Space and Neural Nets Based Framework for Failure Modes Clustering in Electronics Subjected to Mechanical Shock

  • Author

    Lall, Pradeep ; Gupta, Prashant ; Goebel, Kai

  • Author_Institution
    Dept. of Mech. Eng., Auburn Univ., Auburn, AL, USA
  • Volume
    61
  • Issue
    4
  • fYear
    2012
  • Firstpage
    884
  • Lastpage
    900
  • Abstract
    Electronic systems under extreme shock and vibration environments may sustain several failure modes simultaneously. Previous experience indicates that the dominant failure modes experienced by packages in a drop and shock framework are in the solder interconnects including cracks at the package and the board interface, pad cratering, copper trace fatigue, and bulk-failure in the solder joint. In this paper, a method has been presented for failure mode classification using a combination of Karhunen Loéve transform with parity-based stepwise supervised training of a perceptrons. New is the early classification of multiple failure modes in the pre-failure space using supervised neural networks in conjunction with a Karhunen Loéve transform. The feature space has been formed by joint time frequency analysis. Because the cumulative damage may be accrued under repetitive loading with exposure to multiple shock events, the area array assemblies have been exposed to shock and feature vectors constructed to track damage initiation and progression. The error back propagation learning algorithm has been used for stepwise parity of each particular failure mode. The classified failure modes and failure regions belonging to each particular failure mode in the feature space are also validated by simulation of the designed neural network used for parity of feature space. Statistical similarity and validation of different classified dominant failure modes is performed by multivariate analysis of variance and Hotelling´s T-square. The results of different classified dominant failure modes are also correlated with the experimental cross sections of the failed test assemblies. The methodology adopted in this paper can perform real-time fault monitoring with identification of a specific dominant failure mode, and is scalable to system level reliability.
  • Keywords
    Karhunen-Loeve transforms; backpropagation; copper; electronic engineering computing; failure analysis; fatigue; integrated circuit interconnections; neural nets; solders; statistical analysis; time-frequency analysis; vibrations; Hotelling T-square; Karhunen Loéve transform; board interface; bulk-failure; copper trace fatigue; cumulative damage; decorrelated feature space; electronic system; error back propagation learning algorithm; failure mode classification; failure mode clustering; fault monitoring; joint time frequency analysis; mechanical shock; multivariate analysis; pad cratering; parity-based stepwise supervised training; shock framework; solder interconnect; solder joint; statistical similarity; supervised neural network; system level reliability; vibration; Prognostics and health management; Real-time systems; Shock (mechanics); Supervised learning; Time frequency analysis; Fault isolation; feature vectors; perceptron; prognostics health monitoring; supervised learning;
  • fLanguage
    English
  • Journal_Title
    Reliability, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9529
  • Type

    jour

  • DOI
    10.1109/TR.2012.2222611
  • Filename
    6331594