DocumentCode
1320131
Title
Fundamental investigation of roll bond heat pipe as heat spreader plate for notebook computers
Author
Take, Koichiro ; Furukawa, Yuichi ; Ushioda, Shunta
Author_Institution
Dept. of Res. & Dev., Showa Aluminum Corp., Tochigi, Japan
Volume
23
Issue
1
fYear
2000
fDate
3/1/2000 12:00:00 AM
Firstpage
80
Lastpage
85
Abstract
A roll bond heat pipe (RBHP) is very promising in the cooling of electronic equipment such as notebook computers. This study presents prediction data on maximum capillary limit obtained for the RBHP with 7.8 mm wide flow channel. Further, experimental study has been conducted to show the difference between the highest and lowest temperatures on the RBHP. These data determine the optimum working fluid charge volume and number of capillary loops for the RBHP
Keywords
cooling; heat pipes; notebook computers; thermal management (packaging); capillary flow; electronic cooling; heat spreader plate; notebook computer; roll bond heat pipe; Aluminum; Bonding; Contact resistance; Electronics cooling; Friction; Hydraulic diameter; Microcomputers; Permeability; Resistance heating; Temperature;
fLanguage
English
Journal_Title
Components and Packaging Technologies, IEEE Transactions on
Publisher
ieee
ISSN
1521-3331
Type
jour
DOI
10.1109/6144.833045
Filename
833045
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