Evaluation of high-voltage cascode GaN HEMT in different packages

This paper presents the evaluation of high-voltage cascode gallium nitride (GaN) high-electron-mobility transistors (HEMT) in different packages. The high-voltage cascode GaN HEMT in traditional package has high turn-on loss in hard-switching turn-on condition, and severe internal parasitic ringing, which could possibly damage the gate of GaN HEMT, in hard-switching turn-off condition, due to package parasitics. To solve these problems a stack-die package is introduced, which is able to eliminate all the critical common-source inductors in traditional package, avoiding side effects caused by the package, and thus could be more suitable for MHz high frequency operation. A prototype of this stack-die package is fabricated in the lab, experimental results are shown to verify the analysis and to demonstrate the strength of the stack-die package.