DocumentCode
1323271
Title
Proposed configuration of integrated optical isolator employing wafer-direct bonding technique
Author
Yokoi, H. ; Mizumoto, T.
Author_Institution
Dept. of Phys. Electron., Tokyo Inst. of Technol., Japan
Volume
33
Issue
21
fYear
1997
fDate
10/9/1997 12:00:00 AM
Firstpage
1787
Lastpage
1788
Abstract
A novel configuration of an integrated optical isolator employing a nonreciprocal phase shift is proposed. The isolator is equipped with a cladding layer of magnetic garnets by means of a wafer-direct bonding technique. Magnetic garnets with a large magnetooptic effect miniaturise the size of the nonreciprocal phase shifter to several hundreds of microns
Keywords
integrated optics; magneto-optical isolators; optical fabrication; wafer bonding; cladding layer; integrated optical isolator; magnetooptic effect; nonreciprocal phase shift; wafer-direct bonding technique;
fLanguage
English
Journal_Title
Electronics Letters
Publisher
iet
ISSN
0013-5194
Type
jour
DOI
10.1049/el:19971253
Filename
633393
Link To Document