DocumentCode
1326204
Title
Eliminating the Low-Frequency Breakdown Problem in 3-D Full-Wave Finite-Element-Based Analysis of Integrated Circuits
Author
Zhu, Jianfang ; Jiao, Dan
Author_Institution
Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
Volume
58
Issue
10
fYear
2010
Firstpage
2633
Lastpage
2645
Abstract
An effective method is developed in this work to extend the validity of a full-wave finite-element-based solution down to dc for general 3-D problems. In this method, we accurately decompose the Maxwell´s system at low frequencies into two subsystems in the framework of a full-wave-based solution. One has an analytical frequency dependence, whereas the other can be solved at frequencies as low as dc. Thus, we bypass the numerical difficulty of solving a highly ill-conditioned and even singular system at low frequencies. In addition, we provide a theoretical analysis on the conditioning of the matrices of the original coupled Maxwell´s system and the decomposed system. We show that the decomposed system is well conditioned, and also positive definite at dc. The validity and accuracy of the proposed method have been demonstrated by extraction of state-of-the-art on-chip integrated circuits at frequencies as low as dc.
Keywords
Maxwell equations; finite element analysis; integrated circuit testing; 3D full-wave finite-element-based analysis; Maxwell´s system; decomposed system; full-wave finite-element-based solution; low-frequency breakdown problem elimination; state-of-the-art on-chip integrated circuits; Conductors; Eigenvalues and eigenfunctions; Electric breakdown; Frequency dependence; Integrated circuit modeling; Propagation; System-on-a-chip; Electromagnetic analysis; finite-element methods (FEMs); full-wave analysis; integrated circuits (ICs); low-frequency breakdown;
fLanguage
English
Journal_Title
Microwave Theory and Techniques, IEEE Transactions on
Publisher
ieee
ISSN
0018-9480
Type
jour
DOI
10.1109/TMTT.2010.2065930
Filename
5575379
Link To Document