• DocumentCode
    1326204
  • Title

    Eliminating the Low-Frequency Breakdown Problem in 3-D Full-Wave Finite-Element-Based Analysis of Integrated Circuits

  • Author

    Zhu, Jianfang ; Jiao, Dan

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
  • Volume
    58
  • Issue
    10
  • fYear
    2010
  • Firstpage
    2633
  • Lastpage
    2645
  • Abstract
    An effective method is developed in this work to extend the validity of a full-wave finite-element-based solution down to dc for general 3-D problems. In this method, we accurately decompose the Maxwell´s system at low frequencies into two subsystems in the framework of a full-wave-based solution. One has an analytical frequency dependence, whereas the other can be solved at frequencies as low as dc. Thus, we bypass the numerical difficulty of solving a highly ill-conditioned and even singular system at low frequencies. In addition, we provide a theoretical analysis on the conditioning of the matrices of the original coupled Maxwell´s system and the decomposed system. We show that the decomposed system is well conditioned, and also positive definite at dc. The validity and accuracy of the proposed method have been demonstrated by extraction of state-of-the-art on-chip integrated circuits at frequencies as low as dc.
  • Keywords
    Maxwell equations; finite element analysis; integrated circuit testing; 3D full-wave finite-element-based analysis; Maxwell´s system; decomposed system; full-wave finite-element-based solution; low-frequency breakdown problem elimination; state-of-the-art on-chip integrated circuits; Conductors; Eigenvalues and eigenfunctions; Electric breakdown; Frequency dependence; Integrated circuit modeling; Propagation; System-on-a-chip; Electromagnetic analysis; finite-element methods (FEMs); full-wave analysis; integrated circuits (ICs); low-frequency breakdown;
  • fLanguage
    English
  • Journal_Title
    Microwave Theory and Techniques, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9480
  • Type

    jour

  • DOI
    10.1109/TMTT.2010.2065930
  • Filename
    5575379