• DocumentCode
    1330130
  • Title

    Multilayer Substrate Integrated Waveguide Four-Way Out-of-Phase Power Divider

  • Author

    Eom, Dong-Sik ; Byun, Jindo ; Lee, Hai-Young

  • Author_Institution
    Dept. of Electron. Eng., Ajou Univ., Suwon, South Korea
  • Volume
    57
  • Issue
    12
  • fYear
    2009
  • Firstpage
    3469
  • Lastpage
    3476
  • Abstract
    In this paper, a multilayer substrate integrated waveguide (SIW) four-way out-of-phase power divider is investigated. In a previous research (Eom , 2009), the four-way power division was studied by a 3-D mode coupling method, which was achieved by a vertical Y-junction as well as a lateral Y-junction of half mode substrate integrated waveguides (HMSIW) using a multilayer substrate. In this research, resistive coupling slots, for obtaining good isolation between four output ports and impedance matching at all the ports, are realized on the lateral HMSIW Y-junctions and the vertical HMSIW Y-junctions using isolation resistors. From the measurement results, excellent performances of insertion loss, isolation, impedance matching, and amplitude balancing were simultaneously achieved for the X-band range. It is expected that the proposed design of a multilayer substrate integrated waveguide (ML-SIW) power divider will play an important role in the future integration of compact multiway SIW circuits and systems.
  • Keywords
    electromagnetic coupling; impedance matching; power dividers; substrate integrated waveguides; waveguide junctions; 3D mode coupling method; four-way out-of-phase power divider; half mode substrate integrated waveguides; impedance matching; insertion loss; lateral HMSIW Y-junction; multilayer substrate integrated waveguide; resistive coupling slots; vertical HMSIW Y-junction; Multilayer substrate; power divider; substrate integrated waveguide (SIW);
  • fLanguage
    English
  • Journal_Title
    Microwave Theory and Techniques, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9480
  • Type

    jour

  • DOI
    10.1109/TMTT.2009.2034311
  • Filename
    5332235