• DocumentCode
    133070
  • Title

    On-chip coupled power inductor for switching power converters

  • Author

    Zhigang Dang ; Qahouq, Jaber A. Abu

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Alabama, Tuscaloosa, AL, USA
  • fYear
    2014
  • fDate
    16-20 March 2014
  • Firstpage
    2854
  • Lastpage
    2859
  • Abstract
    This paper proposes a design of an on-chip coupled power inductor (OCPI) structure which consists of a layer of ferrite core material and another layer of coupled spiral windings on a silicon substrate. The flux cancellation effect of the two inversely coupled windings significantly reduces the net fluxes in the ferrite layer, which helps increasing the saturation current of the power inductor. An ANSYS®/Maxwell® 3-D physical model of a 5.6mm×5.6mm two-phase OCPI is developed and simulation results are obtained. Simulation results show that the saturation current (7A/phase) of the OCPI is twice the saturation current (3.5A) of the non-coupled power inductor with the same inductance density. Based on a 3.3V/1.5V 4MHz two-phase buck converter, the equivalent steady state inductance and transient inductance of the OCPI are calculated to be equal to 78.1nH and 22.2nH, respectively.
  • Keywords
    DC-DC power convertors; ferrites; finite element analysis; inductance; machine windings; power inductors; silicon; switching convertors; ANSYS®/Maxwell® 3D physical model; OCPI structure; coupled spiral windings; current 3.5 A; equivalent steady state inductance; ferrite core material; ferrite layer; flux cancellation effect; frequency 4 MHz; inductance density; inversely coupled windings; noncoupled power inductor; on-chip coupled power inductor; silicon substrate; size 5.6 mm; switching power converter; transient inductance; two phase buck converter; voltage 3.3 V to 1.5 V; Ferrites; Inductance; Inductors; Spirals; Steady-state; System-on-chip; Windings;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Applied Power Electronics Conference and Exposition (APEC), 2014 Twenty-Ninth Annual IEEE
  • Conference_Location
    Fort Worth, TX
  • Type

    conf

  • DOI
    10.1109/APEC.2014.6803709
  • Filename
    6803709