Improved Output Power of InGaN-Based Ultraviolet LEDs Using a Heavily Si-Doped GaN Insertion Layer Technique

In this paper, a high quality ultraviolet light-emitting diodes (UV-LEDs) at 375 nm was developed using a heavy Si-doping technique with metal organic chemical vapor deposition. By using high-resolution X-ray diffraction, the full width at half-maximum of the rocking curve shows that the GaN film inserting a heavily Si-doped GaN layer (Si-HDL) had high crystalline quality. From the transmission electron microscopy image, the threading dislocation density was decreased after inserting a Si-HDL between undoped and n-doped GaN layers by nanoscale epitaxial lateral overgrowth. As a result, a much smaller reverse current and a higher light output were achieved. The improvement of light output at an injection current of 20 mA was enhanced by 40%. Therefore, we can use an in-situ nano pattern without complex photolithography and etching process and improve the internal quantum efficiency of UV-LEDs.