Process Variability Effect on Soft Error Rate by Characterization of Large Number of Samples

Author

Gasiot, Gilles ; Castelnovo, Alexandro ; Glorieux, Maximilien ; Abouzeid, Fady ; Clerc, Sylvain ; Roche, Philippe

Author_Institution

STMicroelectron., Crolles, France

Volume

59

Issue

6

fYear

2012

Firstpage

2914

Lastpage

2919

Abstract

For the first time die-to-die soft error rate (SER) variability from process manufacturing is experimentally characterized by irradiating a very large number of samples from a single wafer. Alpha and neutron SER is measured and reported as a function of original location on wafer, test dates and samples capacity. CAD tools are then used to evaluate their capacity to assess die-to-die alpha and neutron SER variability.

Keywords

alpha-particle effects; neutron effects; radiation hardening (electronics); CAD tools; die-to-die alpha soft error rate variability; die-to-die neutron soft error rate variability; process manufacturing; process variability effect; sample capacity; single wafer; test dates; Error analysis; Neutrons; Random access memory; Sampling methods; Semiconductor device measurement; Semiconductor device reliability; System-on-a-chip; Alpha and neutron; die-to-die variability; hardness assurance; large sampling; process variability; soft error rate (SER) experimental characterization;

fLanguage

English

Journal_Title

Nuclear Science, IEEE Transactions on

Publisher

ieee

ISSN

0018-9499

Type

jour

DOI

10.1109/TNS.2012.2225447

Filename

6361435