• DocumentCode
    1339591
  • Title

    A Physics-Based Engineering Approach to Predict the Cross Section for Advanced SRAMs

  • Author

    Li, Lei ; Zhou, Wanting ; Liu, Huihua

  • Author_Institution
    Res. Inst. of Electron. Sci. & Technol., Univ. of Electron. Sci. & Technol. of China, Chengdu, China
  • Volume
    59
  • Issue
    6
  • fYear
    2012
  • Firstpage
    3265
  • Lastpage
    3271
  • Abstract
    This paper presents a physics-based engineering approach to estimate the heavy ion induced upset cross section for 6T SRAM cells from layout and technology parameters. The new approach calculates the effects of radiation with junction photocurrent, which is derived based on device physics. The new and simple approach handles the problem by using simple SPICE simulations. At first, the approach uses a standard SPICE program on a typical PC to predict the SPICE-simulated curve of the collected charge vs. its affected distance from the drain-body junction with the derived junction photocurrent. And then, the SPICE-simulated curve is used to calculate the heavy ion induced upset cross section with a simple model, which considers that the SEU cross section of a SRAM cell is more related to a “radius of influence” around a heavy ion strike than to the physical size of a diffusion node in the layout for advanced SRAMs in nano-scale process technologies. The calculated upset cross section based on this method is in good agreement with the test results for 6T SRAM cells processed using 90 nm process technology.
  • Keywords
    SRAM chips; 6T SRAM cells; SPICE simulations; SPICE-simulated curve; advanced SRAM; derived junction photocurrent; diffusion node; drain-body junction; heavy ion induced upset cross section; heavy ion strike; nano-scale process technologies; physics-based engineering approach; standard SPICE program; Layout; MOSFETs; Physics; Random access memory; SPICE; Heavy ion; SRAM; upset cross section;
  • fLanguage
    English
  • Journal_Title
    Nuclear Science, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9499
  • Type

    jour

  • DOI
    10.1109/TNS.2012.2222444
  • Filename
    6361438