Computer-aided design considerations for mixed-signal coupling in RF integrated circuits

This paper reviews computer-aided design techniques to address mixed-signal coupling in integrated circuits, particularly wireless RF circuits. Mixed-signal coupling through the chip interconnects, substrate, and package is detrimental to wireless circuit performance as it can swamp out the small received signal prior to amplification or during the mixing process. Specialized simulation techniques for the analysis of periodic circuits in conjunction with semi-analytical methods for chip substrate modeling help analyze the impart of mixed-signal coupling mechanisms on such integrated circuits. Application of these computer-aided design techniques to real-life problems is illustrated with the help of a design example. Design techniques to mitigate mixed-signal coupling can be determined with the help of these modeling and analysis methods