• DocumentCode
    1341586
  • Title

    Transient Thermal Network Modeling Applied to Multiscale Systems. Part I: Definition and Validation

  • Author

    Miana, Mario ; Cortés, Cristóbal ; Pelegay, José Luis ; Valdés, José Ramón ; Pütz, Thomas

  • Author_Institution
    Dept. of Res., Dev. & Technol. Services, Technol. Inst. of Aragon, Zaragoza, Spain
  • Volume
    33
  • Issue
    4
  • fYear
    2010
  • Firstpage
    924
  • Lastpage
    937
  • Abstract
    This paper formulates the methodology of transient thermal network modeling (TTNM) for the study of unsteady heat transfer in systems where the presence of multiple length and time scales prevents the analysis by means of current computational or experimental techniques. The TTNM is based on reduced order models (ROMs) and it is established under the essential premise that a transient heat transfer process can be modeled by its division in a succession of stationary states and the division of the geometry in isothermal elements, according to the characteristic time and length scales obtained by scale analysis. The methodology is subsequently validated with canonical examples and considerations are given for the application to practical problems.
  • Keywords
    geometry; heat transfer; reduced order systems; thermal management (packaging); geometry; isothermal element; multiscale system; reduced order model; scale analysis; transient heat transfer process; transient thermal network modeling; unsteady heat transfer; Cooling; Heat transfer; Read only memory; Solids; Temperature; Transient analysis; Reduced order models; scale analysis; unsteady heat transfer;
  • fLanguage
    English
  • Journal_Title
    Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3323
  • Type

    jour

  • DOI
    10.1109/TADVP.2010.2074200
  • Filename
    5593895