DocumentCode
1341586
Title
Transient Thermal Network Modeling Applied to Multiscale Systems. Part I: Definition and Validation
Author
Miana, Mario ; Cortés, Cristóbal ; Pelegay, José Luis ; Valdés, José Ramón ; Pütz, Thomas
Author_Institution
Dept. of Res., Dev. & Technol. Services, Technol. Inst. of Aragon, Zaragoza, Spain
Volume
33
Issue
4
fYear
2010
Firstpage
924
Lastpage
937
Abstract
This paper formulates the methodology of transient thermal network modeling (TTNM) for the study of unsteady heat transfer in systems where the presence of multiple length and time scales prevents the analysis by means of current computational or experimental techniques. The TTNM is based on reduced order models (ROMs) and it is established under the essential premise that a transient heat transfer process can be modeled by its division in a succession of stationary states and the division of the geometry in isothermal elements, according to the characteristic time and length scales obtained by scale analysis. The methodology is subsequently validated with canonical examples and considerations are given for the application to practical problems.
Keywords
geometry; heat transfer; reduced order systems; thermal management (packaging); geometry; isothermal element; multiscale system; reduced order model; scale analysis; transient heat transfer process; transient thermal network modeling; unsteady heat transfer; Cooling; Heat transfer; Read only memory; Solids; Temperature; Transient analysis; Reduced order models; scale analysis; unsteady heat transfer;
fLanguage
English
Journal_Title
Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1521-3323
Type
jour
DOI
10.1109/TADVP.2010.2074200
Filename
5593895
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