• DocumentCode
    1344133
  • Title

    Design and Implementation of a Novel Hybrid Photonic Crystal Power/Ground Layer for Broadband Power Noise Suppression

  • Author

    Wu, Guan-Zong ; Chen, Yi-Che ; Wu, Tzong-Lin

  • Author_Institution
    Dept. of Electr. of Eng., Nat. Taiwan Univ., Taipei, Taiwan
  • Volume
    33
  • Issue
    1
  • fYear
    2010
  • Firstpage
    206
  • Lastpage
    211
  • Abstract
    By embedding periodically high-K rods in the package substrate, a hybrid photonic crystal power/ground layers (PCPL) is proposed with stopband enhancement for power/ground noise suppression. The hybrid PCPL consists of two different lattice structures, which have the same pitch but different radii of the high-K rods. Using the gap map of the photonic crystal lattice, the enhanced stopband can be synthesized by designing these two different lattices with compensated stopband. An implementation approach, which is compatible to the standard fabrication process of package or printed circuit board (PCB), is also proposed in this paper. The high-K rods are considered as surface mount technology (SMT)-like components and ring-shaped soldering pads with through-hole-via connecting to power/ground planes are designed on the package substrate. A test sample of the hybrid PCPL is fabricated and measured. A wide stopband from 3.2 to 9.5 GHz is achieved with 30 dB of noise suppression in average. This enhanced stopband is consistent with the prediction both by gap map synthesis and full-wave simulation. The hybrid PCPL is applied in a package substrate with voltage-controlled oscillator (VCO) circuit and excellent noise suppression performance is demonstrated.
  • Keywords
    interference suppression; packaging; photonic crystals; printed circuits; soldering; surface mount technology; three-dimensional integrated circuits; voltage-controlled oscillators; broadband power noise suppression; frequency 3.2 GHz to 9.5 GHz; ground layer; ground noise suppression; hybrid photonic crystal power; lattice structures; package substrate; periodically high-K rods; photonic crystal lattice; printed circuit board; ring shaped soldering pads; stopband enhancement; surface mount technology; through hole via; voltage controlled oscillator; Ground bounce noise; photonic crystal; power delivery networks; power integrity; signal integrity; simultaneous switching noise (SSN); system in package (SiP);
  • fLanguage
    English
  • Journal_Title
    Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3323
  • Type

    jour

  • DOI
    10.1109/TADVP.2009.2034334
  • Filename
    5342448