• DocumentCode
    1345996
  • Title

    Sensitivity analysis of multiconductor transmission lines and optimization for high-speed interconnect circuit design

  • Author

    Jiao, Cheng ; Cangellaris, Andreas C. ; Yaghmour, Abdul M. ; Prince, John L.

  • Author_Institution
    Centre for Electron. Packaging Res., Arizona Univ., Tucson, AZ, USA
  • Volume
    23
  • Issue
    2
  • fYear
    2000
  • fDate
    5/1/2000 12:00:00 AM
  • Firstpage
    132
  • Lastpage
    141
  • Abstract
    Sensitivity analysis of multiconductor transmission lines is derived from a new, all-purpose multi-conductor transmission line model in both frequency domain and time domain. Computer implementation of this new model as well as the sensitivity analysis has been completed. It enables efficient, accurate simulations of interconnect circuit responses as well as sensitivity analysis with respect to both electrical and physical transmission line parameters. By applying sensitivity analysis to high-speed interconnect circuit design, design variables are optimized to achieve simultaneous minimization of crosstalk, delays and reflections at desired nodes in the circuit without violating any indispensable design rules. Numerical examples are presented to demonstrate the validity of the proposed sensitivity analysis and illustrate its application to the optimization of high-speed interconnect circuit design
  • Keywords
    VLSI; circuit optimisation; crosstalk; delays; frequency-domain analysis; high-speed integrated circuits; integrated circuit design; integrated circuit interconnections; integrated circuit packaging; multiconductor transmission lines; sensitivity analysis; time-domain analysis; crosstalk; delays; design rules; frequency domain; high-speed interconnect circuit design; interconnect circuit responses; multiconductor transmission lines; optimization; reflections; sensitivity analysis; time domain; transmission line parameters; Analytical models; Circuit synthesis; Computational modeling; Design optimization; Distributed parameter circuits; Frequency domain analysis; Integrated circuit interconnections; Multiconductor transmission lines; Sensitivity analysis; Time domain analysis;
  • fLanguage
    English
  • Journal_Title
    Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3323
  • Type

    jour

  • DOI
    10.1109/6040.846623
  • Filename
    846623