Advanced flip chip bonding techniques using transferred microsolder bumps

Author

Koshoubu, Nobutatsu ; Ishizawa, Suzuko ; Tsunetsugu, Hideki ; Takahara, Hideyuki

Author_Institution

NTT Telecommun. Networks Labs., Tokyo, Japan

Volume

23

Issue

2

fYear

2000

fDate

6/1/2000 12:00:00 AM

Firstpage

399

Lastpage

404

Abstract

For future high-speed and high-density opto-electronic multi-chip module (OE-MCM) packaging, we developed two advanced transferred microsolder bump bonding techniques. One uses 80% Au-Sn, which allows module packaging using processes at various temperatures because it has a higher melting temperature than 100% In and 60% Sn-Pb solders. The other uses multiple transfers of bumps to achieve accurate three-dimensional flip-chip bonding with precise vertical and horizontal alignments within an error of ±0.5 μm. These techniques will thus be very useful in developing high-speed and high-density OE-MCM´s for multi-functional board-level interconnection in future optical communication systems

Keywords

flip-chip devices; integrated circuit bonding; integrated optoelectronics; microassembling; multichip modules; optical communication equipment; soldering; 3D flip-chip bonding; Au-Sn; flip chip bonding techniques; high-density MCM packaging; high-speed opto-electronic packaging; microsolder bump bonding techniques; multi-chip module packaging; multi-functional board-level interconnection; multiple transfers; optical communication systems; opto-electronic MCM packaging; three-dimensional flip-chip bonding; transferred microsolder bumps; Asynchronous transfer mode; Bonding; Closed loop systems; Flip chip; High speed optical techniques; Optical fibers; Optical interconnections; Optical waveguides; Packaging; Temperature;

fLanguage

English

Journal_Title

Components and Packaging Technologies, IEEE Transactions on

Publisher

ieee

ISSN

1521-3331

Type

jour

DOI

10.1109/6144.846781

Filename

846781