• DocumentCode
    1347217
  • Title

    Correction to "High-temperature, low-modulus adhesive attach for large-area thin-film processing on silicon and alumina tiles"

  • Author

    Varyiyam, M. ; Sundararaman, Vijayaraghavan ; Sitaraman, Suresh K. ; Wu, Junyong ; Wong, C.P.

  • Volume
    23
  • Issue
    2
  • fYear
    2000
  • fDate
    4/1/2000 12:00:00 AM
  • Firstpage
    148
  • Lastpage
    148
  • Keywords
    Biographies; Error correction; Semiconductor thin films; Silicon; Transistors;
  • fLanguage
    English
  • Journal_Title
    Electronics Packaging Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-334X
  • Type

    jour

  • DOI
    10.1109/TEPM.2000.846938
  • Filename
    846938