DocumentCode
1347217
Title
Correction to "High-temperature, low-modulus adhesive attach for large-area thin-film processing on silicon and alumina tiles"
Author
Varyiyam, M. ; Sundararaman, Vijayaraghavan ; Sitaraman, Suresh K. ; Wu, Junyong ; Wong, C.P.
Volume
23
Issue
2
fYear
2000
fDate
4/1/2000 12:00:00 AM
Firstpage
148
Lastpage
148
Keywords
Biographies; Error correction; Semiconductor thin films; Silicon; Transistors;
fLanguage
English
Journal_Title
Electronics Packaging Manufacturing, IEEE Transactions on
Publisher
ieee
ISSN
1521-334X
Type
jour
DOI
10.1109/TEPM.2000.846938
Filename
846938
Link To Document