DocumentCode
1348066
Title
Flip-chip solder bond mounting of laser diodes
Author
Edge, C. ; Ash, R.M. ; Jones, C.G. ; Goodwin, M.J.
Author_Institution
Plessey Res. Caswell Ltd., Towcester, UK
Volume
27
Issue
6
fYear
1991
fDate
3/14/1991 12:00:00 AM
Firstpage
499
Lastpage
501
Abstract
The successful hybrid mounting of semiconductor laser diode chips by flip-chip solder bonding is reported. This technique allows accurate chip placement with submicron positioning, and has demonstrated acceptable heat dissipation characteristics.
Keywords
flip-chip devices; semiconductor junction lasers; soldering; Si mother board; accurate chip placement; flip-chip solder bonding; heat dissipation characteristics; hybrid mounting; laser diode bond mounting; semiconductor laser diode chips; submicron positioning;
fLanguage
English
Journal_Title
Electronics Letters
Publisher
iet
ISSN
0013-5194
Type
jour
DOI
10.1049/el:19910314
Filename
84727
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