• DocumentCode
    1353746
  • Title

    A Watt-Level Stacked-FET Linear Power Amplifier in Silicon-on-Insulator CMOS

  • Author

    Pornpromlikit, Sataporn ; Jeong, Jinho ; Presti, Calogero D. ; Scuderi, Antonino ; Asbeck, Peter M.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of California at San Diego, La Jolla, CA, USA
  • Volume
    58
  • Issue
    1
  • fYear
    2010
  • Firstpage
    57
  • Lastpage
    64
  • Abstract
    A single-stage stacked field-effect transistor (FET) linear power amplifier (PA) is demonstrated using 0.28-??m 2.5-V standard I/O FETs in a 0.13-??m silicon-on-insulator (SOI) CMOS technology. To overcome the low breakdown voltage limit of MOSFETs, a stacked-FET structure is employed, where four transistors are connected in series so that their output voltage swings are added in phase. With a 6.5-V supply, the measured PA achieves a small-signal gain of 14.6 dB, a saturated output power of 32.4 dBm, and a maximum power-added efficiency (PAE) of 47% at 1.9 GHz. Using a reverse-link IS-95 code division multiple access modulated signal, the PA shows an average output power of up to 28.7 dBm with a PAE of 41.2% while meeting the adjacent channel power ratio requirement. Using an uplink wideband code division multiple access modulated signal, the PA shows an average output power of up to 29.4 dBm with a PAE of 41.4% while meeting the adjacent channel leakage ratio requirement. The stacked-FET PA is designed to withstand up to 9 V of supply voltage before reaching its breakdown limit. This is the first reported stacked-FET linear PA in submicrometer SOI CMOS technology that delivers watt-level output power in the gigahertz frequency range with efficiency and linearity performance comparable to those of GaAs-based PAs.
  • Keywords
    CMOS integrated circuits; MOSFET; UHF power amplifiers; elemental semiconductors; silicon; silicon-on-insulator; MOSFET; Si; adjacent channel leakage ratio requirement; adjacent channel power ratio requirement; frequency 1.9 GHz; gigahertz frequency; low breakdown voltage limit; maximum power-added efficiency; reverse-link IS-95 code division multiple access modulated signal; silicon-on-insulator CMOS; single-stage FET linear power amplier; single-stage stacked field-effect transistor; size 0.13 mum to 0.28 mum; stacked-FET structure; submicrometer SOI CMOS technology; uplink wideband code division multiple access modulated signal; voltage 2.5 V to 6.5 V; watt-level stacked-FET linear power amplifier; CMOS; code division multiple access (CDMA); power amplifier (PA); silicon-on-insulator (SOI); stacked transistors; wideband code division multiple access (WCDMA);
  • fLanguage
    English
  • Journal_Title
    Microwave Theory and Techniques, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9480
  • Type

    jour

  • DOI
    10.1109/TMTT.2009.2036323
  • Filename
    5352239