• DocumentCode
    1354307
  • Title

    Compact Current Source Models for Timing Analysis Under Temperature and Body Bias Variations

  • Author

    Gupta, Saket ; Sapatnekar, Sachin S.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Minnesota, Minneapolis, MN, USA
  • Volume
    20
  • Issue
    11
  • fYear
    2012
  • Firstpage
    2104
  • Lastpage
    2117
  • Abstract
    State-of-the-art timing tools are built around the use of current source models (CSMs), which have proven to be fast and accurate in enabling the analysis of large circuits. As circuits become increasingly exposed to process and temperature variations, there is a strong need to augment these models to account for thermal effects and for the impact of adaptive body biasing, a compensatory technique that is used to overcome on-chip variations. However, a straightforward extension of CSMs to incorporate timing analysis at multiple body biases and temperatures results in unreasonably large characterization tables for each cell. We propose a new approach to compactly capture body bias and temperature effects within a mainstream CSM framework. Our approach features a table reduction method for compaction of tables and a fast and novel waveform sensitivity method for timing evaluation under any body bias and temperature condition. On a 45-nm technology, we demonstrate high accuracy, with mean errors of under 4% in both slew and delay as compared to HSPICE. We show a speedup of over five orders of magnitude over HSPICE and a speedup of about over conventional CSMs.
  • Keywords
    SPICE; constant current sources; network analysis; HSPICE; adaptive body biasing; compensatory technique; current source models; large circuits analysis; on-chip variations; size 45 nm; state-of-the-art timing tools; thermal effects; timing analysis; Circuit analysis; Computational modeling; Delay; Mathematical model; Sensitivity; Temperature; Body bias; current source models; delay; temperature;
  • fLanguage
    English
  • Journal_Title
    Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1063-8210
  • Type

    jour

  • DOI
    10.1109/TVLSI.2011.2169686
  • Filename
    6054046