DocumentCode
1354552
Title
Estimation of degradation of printed circuit board by growth of ionic migration
Author
Yanagisawa, T.
Author_Institution
Electrotech. Lab., Ibaraki, Japan
Volume
36
Issue
10
fYear
2000
fDate
5/11/2000 12:00:00 AM
Firstpage
869
Lastpage
870
Abstract
To investigate the development and growth process of ionic migration of metals used for wiring, lone term tests on typical printed circuit boards (PCB) have been performed under high humidity and high temperature conditions. A relationship between the electric field (E), the time (t) after which the migration starts to develop and its subsequent rate of growth (ψ) is proposed which can be expressed as ψ=4(Er)α where values of both A and α depend on the PCB material. Values for A and α have been calculated for three PCBs made of different materials
Keywords
circuit reliability; electromigration; humidity; printed circuits; PCB degradation estimation; electric field; growth process; high humidity conditions; high temperature conditions; ionic migration; printed circuit board; wiring metals;
fLanguage
English
Journal_Title
Electronics Letters
Publisher
iet
ISSN
0013-5194
Type
jour
DOI
10.1049/el:20000011
Filename
850497
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