• DocumentCode
    1355167
  • Title

    Degradation of epoxy resin by partial discharges

  • Author

    Hepburn, D.M. ; Kemp, I.J. ; Shields, A.J. ; Cooper, J.

  • Author_Institution
    Dept. of Eng., Glasgow Caledonian Univ., UK
  • Volume
    147
  • Issue
    3
  • fYear
    2000
  • fDate
    5/1/2000 12:00:00 AM
  • Firstpage
    97
  • Lastpage
    104
  • Abstract
    Epoxy resins are used in the production of high-voltage insulation components. Partial discharges, inherent in high-voltage installations, degenerate the resinous material and cause degradation of the insulation thus reducing the working life of the component, An understanding of the nature of the chemical changes taking place under partial discharge stressing should allow the production of improved insulation systems and/or identification of diagnostic methods for monitoring the state of existing equipment. Attenuated total reflectance Fourier transform infrared (ATR-FTIR) microspectroscopy is used to determine the chemical changes to the surface of a bisphenol-A based epoxy resin resulting from partial discharge stressing in an air environment. Differences in stressed resin surface chemistry are found to be dependent upon the humidity of the stressed air. The variation in degradation products occurring in dry and in moist air are discussed and possible reactions to explain these differences are presented
  • Keywords
    Fourier transform spectra; epoxy insulation; humidity; infrared spectra; insulation testing; partial discharges; reflectivity; surface chemistry; ATR-FTIR microspectroscopy; air environment; attenuated total reflectance Fourier transform infrared microspectroscopy; bisphenol-A based epoxy resin; chemical changes; degradation; diagnostic methods; epoxy resin; high-voltage insulation; humidity; moist air; partial discharge stressing; partial discharges; reactions; resinous material; stressed resin surface chemistry; working life;
  • fLanguage
    English
  • Journal_Title
    Science, Measurement and Technology, IEE Proceedings -
  • Publisher
    iet
  • ISSN
    1350-2344
  • Type

    jour

  • DOI
    10.1049/ip-smt:20000370
  • Filename
    850591