DocumentCode
1356415
Title
Passive Equalizer Design for Through Silicon Vias With Perfect Compensation
Author
Sun, Ruey-Bo ; Wen, Chang-Yi ; Wu, Ruey-Beei
Author_Institution
Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Volume
1
Issue
11
fYear
2011
Firstpage
1815
Lastpage
1822
Abstract
This paper proposes a novel passive equalizer which is composed of a parallel resistance-capacitance (RC) circuit and capable of perfect compensation for lossy effects of through silicon via (TSV). To design the equalizer, the conventional transmission line theory is utilized to derive an analytic circuit model of the TSV which is verified by numerical methods. Based on the analytic circuit model, the significance analysis is performed to acquire a much simplified capacitance-conductance circuit model which is employed to construct the design formula for the RC equalizer with perfect compensation. A ten-stacked TSV in series with the designed equalizer is taken as an example to demonstrate the resultant improvement in the eye diagram, namely, nearly zero timing jitter and three times enlarged eye opening.
Keywords
RC circuits; capacitance; electric resistance; equalisers; integrated circuit modelling; three-dimensional integrated circuits; RC circuit; RC equalizer; analytic circuit model; capacitance-conductance circuit model; compensation; lossy effect; parallel resistance-capacitance circuit; passive equalizer; ten-stacked TSV; through silicon via; transmission line theory; zero timing jitter; Analytical models; Integrated circuit modeling; Numerical models; Substrates; Through-silicon vias; Equalizer; loss compensation; through silicon via; vertical interconnection;
fLanguage
English
Journal_Title
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
2156-3950
Type
jour
DOI
10.1109/TCPMT.2011.2164405
Filename
6056558
Link To Document