• DocumentCode
    1356415
  • Title

    Passive Equalizer Design for Through Silicon Vias With Perfect Compensation

  • Author

    Sun, Ruey-Bo ; Wen, Chang-Yi ; Wu, Ruey-Beei

  • Author_Institution
    Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
  • Volume
    1
  • Issue
    11
  • fYear
    2011
  • Firstpage
    1815
  • Lastpage
    1822
  • Abstract
    This paper proposes a novel passive equalizer which is composed of a parallel resistance-capacitance (RC) circuit and capable of perfect compensation for lossy effects of through silicon via (TSV). To design the equalizer, the conventional transmission line theory is utilized to derive an analytic circuit model of the TSV which is verified by numerical methods. Based on the analytic circuit model, the significance analysis is performed to acquire a much simplified capacitance-conductance circuit model which is employed to construct the design formula for the RC equalizer with perfect compensation. A ten-stacked TSV in series with the designed equalizer is taken as an example to demonstrate the resultant improvement in the eye diagram, namely, nearly zero timing jitter and three times enlarged eye opening.
  • Keywords
    RC circuits; capacitance; electric resistance; equalisers; integrated circuit modelling; three-dimensional integrated circuits; RC circuit; RC equalizer; analytic circuit model; capacitance-conductance circuit model; compensation; lossy effect; parallel resistance-capacitance circuit; passive equalizer; ten-stacked TSV; through silicon via; transmission line theory; zero timing jitter; Analytical models; Integrated circuit modeling; Numerical models; Substrates; Through-silicon vias; Equalizer; loss compensation; through silicon via; vertical interconnection;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    2156-3950
  • Type

    jour

  • DOI
    10.1109/TCPMT.2011.2164405
  • Filename
    6056558