DocumentCode
1357250
Title
Construction of SEU Tolerant Flip-Flops Allowing Enhanced Scan Delay Fault Testing
Author
Namba, Kazuteru ; Ikeda, Takashi ; Ito, Hideo
Author_Institution
Grad. Sch. of Adv. Integration Sci., Chiba Univ., Chiba, Japan
Volume
18
Issue
9
fYear
2010
Firstpage
1265
Lastpage
1276
Abstract
In recent high-density VLSIs, soft errors, particularly single event upsets (SEUs), frequently occur during system operation. In addition, the occurrence of delay faults caused by manufacturing defects is a significant problem. Thus, SEU tolerant design and delay fault testing are of increasing significance. This paper presents two types of SEU tolerant flip-flops (FFs). The proposed FFs tolerate SEUs caused by particles striking feedback loops in the FFs. Moreover, the proposed FFs allow enhanced scan delay fault testing. The proposed FFs are master-slave FFs, and the slave latches are constructed by modifying existing SEU tolerant latches, namely, SEH latches. The two proposed FFs tolerate particles with charges of 370 fC and of 369 fC or lower, whereas an existing SEU tolerant enhanced scan FF, called an ESFF-SEC, tolerates those of 431 fC or lower. Furthermore, the areas of the proposed FFs are 23.1% and 20.5% smaller than that of the ESFF-SEC. The CK-Q delay times are 44.4% and 41.1% shorter than that of the ESFF-SEC. Moreover, the average power consumptions of the proposed FFs during system operations are 55.6% and 53.3% lower than that of the ESFF-SEC.
Keywords
VLSI; circuit testing; fault diagnosis; feedback; flip-flops; power consumption; SEU tolerant flip-flops; VLSI; enhanced scan delay fault testing; feedback loops; power consumptions; single event upsets; soft errors; Circuit faults; Circuit testing; Delay; Design for testability; Flip-flops; Indium tin oxide; Latches; Manufacturing; Single event upset; Very large scale integration; Delay fault testing; enhanced scan testing; scan flip-flop; single event upset (SEU); soft error tolerance;
fLanguage
English
Journal_Title
Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
Publisher
ieee
ISSN
1063-8210
Type
jour
DOI
10.1109/TVLSI.2009.2022083
Filename
5223636
Link To Document