• DocumentCode
    1361082
  • Title

    A Computational Design Methodology for Assembly and Actuation of Thin-Film Structures via Patterning of Eigenstrains

  • Author

    Howard, Micah ; Pajot, Joe ; Maute, Kurt ; Dunn, Martin L.

  • Author_Institution
    Dept. of Aerosp. Eng. Sci., Univ. of Colorado, Boulder, CO, USA
  • Volume
    18
  • Issue
    5
  • fYear
    2009
  • Firstpage
    1137
  • Lastpage
    1148
  • Abstract
    We develop a computational approach to design 3-D structures that can be fabricated and then assembled and/or actuated by spatially tailoring the layout of multilayer films with eigenstrains. Eigenstrains are stress-free strains when they occur in an unconstrained solid. They are almost an inevitable companion, albeit often unwanted, of thin-film processes. When they vary through the thickness, the constraint of the layers leads to internal stresses and bending and buckling deformations can occur; when they additionally vary in the plane of the film, more complex deformations can result. To advantageously use this phenomenon, we build on relatively simple mechanics ideas in a continuum formulation and combine geometrically nonlinear finite-element analysis of arbitrary-shaped multilayer films with a topology optimization methodology to determine the material layout in each layer so the film deforms into a prescribed shape. We expand our previous experimentally validated approach to include initially curved films and anisotropic eigenstrains. Using an extended system formulation for directly computing instability points allows us to tailor postbuckling response while explicitly controlling the design at limit and bifurcation points. We demonstrate the potential and versatility of our approach by applying it to a series of problems of contemporary and emerging interest.
  • Keywords
    Ge-Si alloys; III-V semiconductors; bending; bifurcation; buckling; eigenvalues and eigenfunctions; finite element analysis; indium compounds; internal stresses; semiconductor materials; semiconductor thin films; 3-D structures design; InAs; SiGe; actuation; anisotropic eigenstrains; bending; bifurcation points; buckling deformations; complex deformations; eigenstrains patterning; internal stresses; multilayer films; nonlinear finite-element analysis; optimization methodology; tailor postbuckling response; thin-film structures; Design methodology; microelectromechanical devices; patterning; thin film;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/JMEMS.2009.2025562
  • Filename
    5229217