• DocumentCode
    1362151
  • Title

    Integration of Grid Array Antenna in Chip Package for Highly Integrated 60-GHz Radios

  • Author

    Sun, Mei ; Zhang, Y.P. ; Guo, Y.X. ; Chua, K.M. ; Wai, L.L.

  • Author_Institution
    Inst. for Infocomm Res., Singapore, Singapore
  • Volume
    8
  • fYear
    2009
  • fDate
    7/1/1905 12:00:00 AM
  • Firstpage
    1364
  • Lastpage
    1366
  • Abstract
    A grid array antenna integrated in a thin cavity-down ceramic ball grid array (CBGA) package in low-temperature cofired ceramic (LTCC) technology is reported. The grid array antenna, intended for use in highly integrated 60-GHz radios, has achieved good matching (|S11| ?? -10 dB) and directional patterns from 57 to 64 GHz as well as high gain with the peak value of 13.5 dBi at 60 GHz.
  • Keywords
    antenna arrays; ball grid arrays; ceramic packaging; chip package; frequency 57 GHz to 64 GHz; frequency 60 GHz; grid array antenna; integrated radios; low-temperature cofired ceramic technology; thin cavity-down ceramic ball grid array package; 60-GHz radio; grid array antenna; grid array package; low-temperature cofired ceramic (LTCC);
  • fLanguage
    English
  • Journal_Title
    Antennas and Wireless Propagation Letters, IEEE
  • Publisher
    ieee
  • ISSN
    1536-1225
  • Type

    jour

  • DOI
    10.1109/LAWP.2009.2039031
  • Filename
    5357445
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1362151