• DocumentCode
    1370170
  • Title

    Effect of silicone vapor and humidity on contact reliability of micro relay contacts

  • Author

    Tamai, Terutaka

  • Author_Institution
    Electron. Inst., Hyogo Univ. of Teacher Educ., Hyogo, Japan
  • Volume
    19
  • Issue
    3
  • fYear
    1996
  • fDate
    9/1/1996 12:00:00 AM
  • Firstpage
    329
  • Lastpage
    338
  • Abstract
    Contact resistance characteristics of a micro relay with Au(90 wt%)-Ag(10 wt%) cladded contacts were examined in air containing silicone vapor and in air mixed with the silicone vapor and high humidity. Electrical conditions for resistive loads of the contacts were covered with four regions such as bridge region, the first micro-arc region, the second micro-arc region, and arc region. Concentrations of the silicone vapor were selected: 1300 ppm which gives saturation of the vapor and 7 ppm which is the safety level for the contact reliability. Moreover, the effect of humidity on dynamic contact resistance characteristics in the silicone environment was also studied. As a result, a boundary of occurrence of contact failure in a relationship between voltage and current was found. This boundary was given by a certain electrical power. The number of operations to failure was found to be inversely proportional to electric power. Under condition of high humidity, low contact resistance maintained longer operation time than low humidity
  • Keywords
    contact resistance; electrical contacts; humidity; relays; reliability; silicones; Au-Ag; arc; bridge; contamination; dynamic contact resistance; electrical power; failure; humidity; micro relay contact; micro-arc; reliability; resistive load; silicone vapor; Bridge circuits; Contact resistance; Humidity; Microrelays; Safety; Senior members; Surface contamination; Surface resistance; Temperature; Voltage;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1070-9886
  • Type

    jour

  • DOI
    10.1109/95.536834
  • Filename
    536834