• DocumentCode
    1370429
  • Title

    On-Chip Wireless Optical Broadcast Interconnection Network

  • Author

    Zhou, Hongyu ; Li, Zheng ; Shang, Li ; Mickelson, Alan ; Filipovic, Dejan S.

  • Author_Institution
    Dept. of Electr., Comput., & Energy Eng., Univ. of Colorado at Boulder, Boulder, CO, USA
  • Volume
    28
  • Issue
    24
  • fYear
    2010
  • Firstpage
    3569
  • Lastpage
    3577
  • Abstract
    An on-chip wireless optical broadcast network for future multicore CPU interconnections is introduced in this paper. A baseline topology is composed of 32 identical transmitting/receiving optical dielectric rod antennas arranged around a circular ring. To ensure balanced power distribution between the channels, the optical antenna design was governed by the antennas´ far-field radiation pattern and near-field coupling. Over the frequency range of 172 THz (1750 nm) and 222 THz (1350 nm), the broadcasting network has average and minimum transmissions of -16 and -21.5 dB, respectively. The overall transmission efficiency is maintained above 70% throughout the operating bandwidth. Results are confirmed by the full-wave simulations based on finite integration and finite element methods. For additional validation, an eight-channel microwave broadcasting network is fabricated, and excellent agreement between the full-wave design and measurements are obtained.
  • Keywords
    finite element analysis; multiprocessor interconnection networks; optical interconnections; far-field radiation pattern; finite element method; finite integration method; frequency 172 THz; frequency 222 THz; microwave broadcasting; multicore CPU interconnections; near-field coupling; on-chip wireless optical broadcast interconnection network; optical dielectric rod antennas; overall transmission efficiency; power distribution; Antennas; Bandwidth; Finite element methods; Integrated optics; Optical waveguides; Silicon; System-on-a-chip; Multicore interconnection; on-chip broadcast; optical antenna; silicon photonics; silicon-on-insulator (SOI) wafer;
  • fLanguage
    English
  • Journal_Title
    Lightwave Technology, Journal of
  • Publisher
    ieee
  • ISSN
    0733-8724
  • Type

    jour

  • DOI
    10.1109/JLT.2010.2091105
  • Filename
    5621877