Equivalent circuit for multiple vias in parallel plate environment

An equivalent one-dimensional circuit has been developed to model the loading effects of vias (through or buried) in a parallel plate environment. Owing to the one-dimensional nature of the model, the simulation time is dramatically reduced, compared to either two-dimensional inductance-capacitance ladder network or full-wave numerical electromagnetic simulations. This model can be easily included in available commercial circuit simulators and accounts for multiple via interactions as well as for substrate edge reflections