• DocumentCode
    1375370
  • Title

    Electromechanical Characterization of Bi-2212 Strands

  • Author

    Lu, X.F. ; Cheggour, N. ; Stauffer, T.C. ; Clickner, C.C. ; Goodrich, L.F. ; Trociewitz, U. ; Myers, D. ; Holesinger, T.G.

  • Author_Institution
    Nat. Inst. of Stand. & Technol., Boulder, CO, USA
  • Volume
    21
  • Issue
    3
  • fYear
    2011
  • fDate
    6/1/2011 12:00:00 AM
  • Firstpage
    3086
  • Lastpage
    3089
  • Abstract
    The uniaxial strain dependence of critical current was measured both in tension and compression in Bi2Sr2CaCu2O8+x (Bi-2212) high-temperature superconducting round wires. Permanent damage to the critical current easily occurred due to strain. To improve the electromechanical properties of Bi-2212 wires, development of stronger sheathing materials is needed. Ideal materials would be not only mechanically strong, but also chemically compatible with Bi-2212 during the final heat treatment. To identify such materials, we measured stress-strain properties of some new Ag alloys and extracted their respective Young´s modulus values and yield strength. The database may be useful for development of new Bi-2212 strands for fabricating high-field superconducting magnets above 20 T.
  • Keywords
    Young´s modulus; bismuth compounds; calcium compounds; electrochemistry; heat treatment; high-temperature superconductors; stress-strain relations; strontium compounds; superconducting tapes; yield strength; Bi-2212 strands; Bi2Sr2CaCu2O8+x; Young´s modulus; compression; critical current; electromechanical characterization; heat treatment; high-field superconducting magnets; high-temperature superconducting round wires; sheathing materials; stress-strain properties; uniaxial strain; yield strength; Materials; Metals; Strain; Strain measurement; Superconducting magnets; Temperature measurement; Wires; Axial strain; Bi-2212 wires; Young´s modulus; critical current density; stress-strain; yield strength;
  • fLanguage
    English
  • Journal_Title
    Applied Superconductivity, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1051-8223
  • Type

    jour

  • DOI
    10.1109/TASC.2010.2084061
  • Filename
    5629450