• DocumentCode
    1377997
  • Title

    Mobility Enhancement in Strained n -FinFETs: Basic Insight and Stress Engineering

  • Author

    Serra, Nicola ; Esseni, David

  • Author_Institution
    Dept. of Electr., Manage. & Mech. Eng. (DIEGM ), Univ. of Udine, Udine, Italy
  • Volume
    57
  • Issue
    2
  • fYear
    2010
  • Firstpage
    482
  • Lastpage
    490
  • Abstract
    This paper presents both analytical models and Monte Carlo simulations concerning strain engineering in n-type silicon FinFETs. Our analysis identifies the stress configurations and the physical mechanisms able to produce a significant stress-induced mobility enhancement and provides the insight necessary for device optimization. We first derive analytical expressions for the stress-induced changes of the subband minima and of the transport masses, which clearly identify the stress components leading to mobility improvements. Then, we present multisubband Monte Carlo mobility simulations, which confirm the potentials for remarkable stress-induced mobility enhancements in n-FinFETs.
  • Keywords
    MOSFET; Monte Carlo methods; elemental semiconductors; internal stresses; semiconductor device models; silicon; stress analysis; stress effects; Si; analytical model; device optimization; multisubband Monte Carlo simulations; n-type silicon FinFET; physical mechanism; strain engineering; strained n-FinFET; stress engineering; stress-induced mobility enhancement; subband minima; transport mass; Analytical models; CMOS integrated circuits; Capacitive sensors; Circuit simulation; Distributed control; Electron mobility; FinFETs; Monte Carlo methods; Silicon; Stress; Crystal orientation; FinFET; electron mobility; strain; strain engineering;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2009.2037369
  • Filename
    5373947