DocumentCode
1377997
Title
Mobility Enhancement in Strained
-FinFETs: Basic Insight and Stress Engineering
Author
Serra, Nicola ; Esseni, David
Author_Institution
Dept. of Electr., Manage. & Mech. Eng. (DIEGM ), Univ. of Udine, Udine, Italy
Volume
57
Issue
2
fYear
2010
Firstpage
482
Lastpage
490
Abstract
This paper presents both analytical models and Monte Carlo simulations concerning strain engineering in n-type silicon FinFETs. Our analysis identifies the stress configurations and the physical mechanisms able to produce a significant stress-induced mobility enhancement and provides the insight necessary for device optimization. We first derive analytical expressions for the stress-induced changes of the subband minima and of the transport masses, which clearly identify the stress components leading to mobility improvements. Then, we present multisubband Monte Carlo mobility simulations, which confirm the potentials for remarkable stress-induced mobility enhancements in n-FinFETs.
Keywords
MOSFET; Monte Carlo methods; elemental semiconductors; internal stresses; semiconductor device models; silicon; stress analysis; stress effects; Si; analytical model; device optimization; multisubband Monte Carlo simulations; n-type silicon FinFET; physical mechanism; strain engineering; strained n-FinFET; stress engineering; stress-induced mobility enhancement; subband minima; transport mass; Analytical models; CMOS integrated circuits; Capacitive sensors; Circuit simulation; Distributed control; Electron mobility; FinFETs; Monte Carlo methods; Silicon; Stress; Crystal orientation; FinFET; electron mobility; strain; strain engineering;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/TED.2009.2037369
Filename
5373947
Link To Document