Thermo-mechanical stress investigation of integrated SAW strain sensors

Author

Hempel, Jochen ; Anees, Sanya ; Wilde, J. ; Reindl, Leonhard

Author_Institution

Dept. of Microsyst. Eng. IMTEK, Univ. of Freiburg, Freiburg, Germany

fYear

2014

fDate

7-9 April 2014

Firstpage

1

Lastpage

4

Abstract

This paper presents investigations of thermo-mechanical stress generated due to the integration process of Surface Acoustic Wave (SAW) strain sensors. A 3D finite element (FE) model, based on visco-elastic material measurements, is developed for thermo-mechanical stress computation. The simulation results are compared with experiments. Therefore, SAW strain sensors were mounted, the sensor response and the sensor deformation measured. The deviation between the simulated and measured sensor chip deflection is ≤ 14.4% for the full measurement range. Simulated thermo-mechanical stresses were used for the frequency shift computation of the SAW sensor device. The calculated frequency shift and the performed deformation measurement verified the correctness of the FE model.

Keywords

deformation; finite element analysis; strain measurement; strain sensors; stress measurement; surface acoustic wave sensors; viscoelasticity; 3D finite element model; FE model; frequency shift computation; integrated SAW strain sensor; sensor chip deflection measurement; sensor deformation measurement; sensor response measurement; surface acoustic wave strain sensor; thermomechanical stress investigation; viscoelastic material measurement; Area measurement; Semiconductor device measurement; Sensors; Strain; Stress; Surface acoustic waves; Temperature measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (eurosime), 2014 15th international conference on

Conference_Location

Ghent

Print_ISBN

978-1-4799-4791-1

Type

conf

DOI

10.1109/EuroSimE.2014.6813773

Filename

6813773