DocumentCode
1380524
Title
Evaluation of solderless wrapped connections for central office use
Author
Elliott, S. J.
Author_Institution
Bell Telephone Laboratories, Inc., New York, N. Y.
Volume
78
Issue
2
fYear
1959
fDate
5/1/1959 12:00:00 AM
Firstpage
185
Lastpage
194
Abstract
Since 1952, when the solderless wrapped connection first was described publicly,1 its use in telephone central offices has grown steadily. Several hundred million solderless connections are being wrapped annually in the Bell System today, and the growth is continuing.
Keywords
Accelerated aging; Copper; Silver; Stress; Temperature measurement; Wires;
fLanguage
English
Journal_Title
American Institute of Electrical Engineers, Part I: Communication and Electronics, Transactions of the
Publisher
ieee
ISSN
0097-2452
Type
jour
DOI
10.1109/TCE.1959.6372979
Filename
6372979
Link To Document