• DocumentCode
    1380537
  • Title

    Low On-Resistance High-Breakdown Normally Off AlN/GaN/AlGaN DHFET on Si Substrate

  • Author

    Medjdoub, F. ; Derluyn, J. ; Cheng, K. ; Leys, M. ; Degroote, S. ; Marcon, D. ; Visalli, D. ; Van Hove, M. ; Germain, M. ; Borghs, G.

  • Author_Institution
    IMEC, Leuven, Belgium
  • Volume
    31
  • Issue
    2
  • fYear
    2010
  • Firstpage
    111
  • Lastpage
    113
  • Abstract
    Ultrathin-barrier normally off AlN/GaN/AlGaN double-heterostructure field-effect transistors using an in situ SiN cap layer have been fabricated on 100-mm Si substrates for the first time. The high 2DEG density in combination with an extremely thin barrier layer leads to enhancement-mode devices with state-of-the-art combination of specific on-resistance that is as low as 1.25 m????cm2 and breakdown voltage of 580 V at V GS = 0 V . Despite the 2-??m gate length used, the transconductance peaks above 300 mS/mm. Furthermore, pulsed measurements show that the devices are dispersion free up to high drain voltage V DS = 50 V. More than 200 devices have been characterized in order to confirm the reproducibility of the results.
  • Keywords
    aluminium compounds; electric breakdown; gallium compounds; high electron mobility transistors; silicon compounds; wide band gap semiconductors; AlN-GaN-AlGaN; DHFET; SiN; breakdown voltage; enhancement-mode devices; low on-resistance; size 100 mm; size 2 mum; thin barrier layer; transconductance; ultra thin barrier double-heterostructure field-effect transistors; voltage 50 V; voltage 580 V; AlN/GaN double-heterostructure field-effect transistor (DHFET); Si substrate; high breakdown voltage; low specific on-resistance; normally off;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2009.2037719
  • Filename
    5378574