• DocumentCode
    1388185
  • Title

    Effects of Pt seed layer and Ar pressure on magnetic and structural properties of sputtered CoNi/Pt multilayers

  • Author

    Meng, Q. ; de Haan, P. ; Van Drent, W.P. ; Lodder, J.C. ; Popma, Th J A

  • Author_Institution
    MESA Res. Inst., Twente Univ., Enschede, Netherlands
  • Volume
    32
  • Issue
    5
  • fYear
    1996
  • fDate
    9/1/1996 12:00:00 AM
  • Firstpage
    4064
  • Lastpage
    4066
  • Abstract
    CoNi/Pt multilayers were prepared by magnetron sputtering using Ar gas. The effects of the Pt seed layer and the Ar sputtering pressure on magnetic and structural properties are investigated. Microstructures of the multilayers were analysed using XRD and TEM. It was found that perpendicular magnetic anisotropy and coercivity increase with an increase in either the thickness of the Pt seed layer or Ar pressure. The causes of the increases in perpendicular anisotropy and coercivity are discussed in relation to the interface roughness, the curvature of layers and the columnar structures
  • Keywords
    X-ray diffraction; cobalt alloys; coercive force; ferromagnetic materials; interface structure; magnetic domain walls; magnetic multilayers; nickel alloys; perpendicular magnetic anisotropy; platinum; sputtered coatings; transmission electron microscopy; Ar; Ar pressure; Ar sputtering pressure; CoNi-Pt; Pt seed layer; TEM; XRD; coercivity; columnar structures; domain wall pinning; interface roughness; layer curvature; magnetic properties; magnetooptical recording; magnetron sputtering; microstructures; perpendicular magnetic anisotropy; sputtered CoNi/Pt multilayers; structural properties; thickness; Anisotropic magnetoresistance; Argon; Coercive force; Magnetic analysis; Magnetic multilayers; Magnetic properties; Microstructure; Perpendicular magnetic anisotropy; Sputtering; X-ray scattering;
  • fLanguage
    English
  • Journal_Title
    Magnetics, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9464
  • Type

    jour

  • DOI
    10.1109/20.539264
  • Filename
    539264