Three-dimensional high-frequency distribution networks. I. Optimization of CPW discontinuities

Author

Weller, Thomas M. ; Henderson, Rashaunda M. ; Herrick, Katherine J. ; Robertson, S.V. ; Kihm, R.T. ; Katehi, Linda P B

Author_Institution

Dept. of Electr. Eng., Univ. of South Florida, Tampa, FL, USA

Volume

48

Issue

10

fYear

2000

fDate

10/1/2000 12:00:00 AM

Firstpage

1635

Lastpage

1642

Abstract

This paper describes a systematic study of coplanar waveguide discontinuities that are requisite components of high-frequency distribution networks. The specific geometries addressed are air bridges, right-angle bends, tee junctions, and Wilkinson dividers. Relative to typical monolithic-microwave integrated-circuit designs, the components studied herein are electrically large in order to minimize signal attenuation. The large size leads to pronounced parasitic effects, and the emphasis of this study was to optimize the electrical performance using simple compensation techniques. The optimization methods are developed using full-wave simulation and equivalent-circuit modeling, and are verified experimentally up to 60 GHz. Part II of this paper describes the implementation and packaging of the components to realize a three-dimensional W-band distribution network

Keywords

MIMIC; circuit simulation; compensation; coplanar waveguides; equivalent circuits; integrated circuit design; waveguide discontinuities; 0 to 60 GHz; CPW discontinuities; Wilkinson dividers; air bridges; compensation techniques; equivalent-circuit modeling; full-wave simulation; millimetre-wave ICs; monolithic-microwave integrated-circuit designs; parasitic effects; right-angle bends; signal attenuation; tee junctions; three-dimensional W-band distribution network; three-dimensional high-frequency distribution networks; Bridge circuits; Capacitance; Coplanar waveguides; Design optimization; Geometry; Laboratories; Micromachining; Optimization methods; Packaging; Signal design;

fLanguage

English

Journal_Title

Microwave Theory and Techniques, IEEE Transactions on

Publisher

ieee

ISSN

0018-9480

Type

jour

DOI

10.1109/22.873890

Filename

873890