DocumentCode
1395092
Title
Packaging and Assembly for Integrated Photonics—A Review of the ePIXpack Photonics Packaging Platform
Author
Zimmermann, Lars ; Preve, Giovan Battista ; Tekin, Tolga ; Rosin, Thomas ; Landles, Kennedy
Author_Institution
Leibniz-Inst., IHP Microelectron., Frankfurt (Oder), Germany
Volume
17
Issue
3
fYear
2011
Firstpage
645
Lastpage
651
Abstract
We review recent work done by the photonics packaging platform ePIXpack that serves the academic community with packaging and assembly developments in the area of integrated photonics. The paper includes recent examples of our packaging and assembly work, covering a broad range of technologies from silicon photonics to InP-based devices.
Keywords
III-V semiconductors; elemental semiconductors; indium compounds; integrated optics; integrated optoelectronics; silicon; wafer level packaging; InP; Si; assembly developments; ePIXpack photonics packaging; integrated photonics; silicon photonics; Assembly; Couplings; Optical waveguides; Packaging; Photonics; Radio frequency; Silicon; Hybrid integrated-circuit packaging; photonic integration; silicon-on-insulator (SOI);
fLanguage
English
Journal_Title
Selected Topics in Quantum Electronics, IEEE Journal of
Publisher
ieee
ISSN
1077-260X
Type
jour
DOI
10.1109/JSTQE.2010.2084992
Filename
5658100
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