Thermal Stability of Cu-Nb Micro-Composites by Bundling and Drawing Process

Author

Ming Liang ; Yafeng Lu ; Xiaoyan Xu ; Pengfei Wang ; Chengshan Li

Author_Institution

Northwest Inst. for Non-ferrous Metal Res., Xi´an, China

Volume

22

Issue

3

fYear

2012

fDate

6/1/2012 12:00:00 AM

Firstpage

6001903

Lastpage

6001903

Abstract

We have fabricated high strength and conductivity Cu-Nb micro-composites by bundling and drawing process. We study the thermal stability of Cu-18vol. %Nb composites for high pulsed magnet use. The evolution of the Nb filaments in the composites during heat treatments is observed by scanning electron microscopy. The mechanism of edge spheroidization and cylinderization phenomenon for Nb filaments is discussed. The changes in mechanical and electrical properties of the Cu-Nb composites resulting from heat treatments are measured. The treatment effect on the properties of the composites with a different size of the Nb filaments is discussed.

Keywords

composite materials; copper alloys; drawing (mechanical); electrical conductivity; heat treatment; niobium alloys; plasticity; scanning electron microscopy; stress-strain relations; thermal stability; bundling process; conductivity; cylinderization; drawing process; edge spheroidization; electrical properties; heat treatments; mechanical properties; microcomposites; niobium filaments; pulsed magnet; scanning electron microscopy; thermal stability; Annealing; Conductivity; Copper; Materials; Morphology; Niobium; Thermal stability; Bundling and drawing process; Cu-Nb; spheroidization; thermal stability;

fLanguage

English

Journal_Title

Applied Superconductivity, IEEE Transactions on

Publisher

ieee

ISSN

1051-8223

Type

jour

DOI

10.1109/TASC.2011.2178985

Filename

6099579