• DocumentCode
    140021
  • Title

    Numerical investigation of the electrical current effect on the fibrous tissue growth around biomaterials

  • Author

    Mahserejian, Shant ; Ryan, Paul ; Djellouli, Rabia ; Cohen, Reuven

  • Author_Institution
    Interdiscipl. Res. Inst. for the Sci. (IRIS), California State Univ. Northridge (CSUN), Northridge, CA, USA
  • fYear
    2014
  • fDate
    26-30 Aug. 2014
  • Firstpage
    3017
  • Lastpage
    3020
  • Abstract
    The objective of this study is to assess numerically the effect of applying electrical current on the fibrous tissue growth around polyethylene disk-shaped implants while subcutaneously placed inside 60 day old male Han-Wistar rats. This problem can be formulated as a design problem where the goal is to determine the parameters of a partial differential operator to achieve a desired effect. These electrical current parameters are computed using a regularized iterative method. The obtained results reveal that employing an appropriate electrical current profile can reduce the fibrous tissue concentration around the considered implant by up to 80%. This preliminary study tends to demonstrate the effectiveness of this novel and non-invasive approach to shield the implant from intolerable levels of fibrous tissue growth, which consequently expands the lifespan and functionality of implanted devices, as well as avoids costly and traumatic surgical procedures.
  • Keywords
    biological tissues; biomedical materials; electric current; iterative methods; polymers; prosthetics; tissue engineering; biomaterials; electrical current effect; fibrous tissue growth; numerical investigation; old male Han-Wistar rats; partial differential operator; polyethylene disk-shaped implants; regularized iterative method; time 60 day; Educational institutions; Electricity; Implants; In vivo; Linear systems; Mathematical model; Rats;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society (EMBC), 2014 36th Annual International Conference of the IEEE
  • Conference_Location
    Chicago, IL
  • ISSN
    1557-170X
  • Type

    conf

  • DOI
    10.1109/EMBC.2014.6944258
  • Filename
    6944258