DocumentCode
1401374
Title
Effect of Au thickness on laser beam penetration in semiconductor laser packages
Author
Cheng, Wood-Hi ; Wang, Szu-Chun ; Yang, Yi-Dian ; Chi, Sien ; Sheen, Maw-Tyan ; Kuang, Jao-Hwa
Author_Institution
Dept. of Electro.-Opt. Eng., Nat. Sun Yat-Sen Univ., Kaohsiung, Taiwan
Volume
20
Issue
4
fYear
1997
fDate
11/1/1997 12:00:00 AM
Firstpage
396
Lastpage
402
Abstract
Comprehensive measurements of the dependence of the weld width, penetration depth, and joint strength on the Au coating thickness in laser welding techniques for semiconductor laser packages are presented. The results obtained from the Invar-Invar joints show that the welded joints with thick Au coating exhibit narrower weld width, shallower penetration, and hence less joint strength than those the package joints with thin Au coating. A finite-element method (FEM) has been carried out on the effect of Au thickness on laser beam penetration in Invar-Invar joints. This method has been employed successfully to predict the laser beam penetration in laser welded Au-coated materials that the weld width and the penetration depth are reduced as the Au coating thickness increases. The likely cause for the reduction is the increased thermal conduction of thicker Au in the welded region. In addition to Au coating, the effect of Ni coating on laser beam penetration is also presented. Detailed knowledge of the effect of Au coating thickness on laser beam penetration is important for the practical design and fabrication of reliable optoelectronic packaging having laser welded Au-coated materials
Keywords
Invar; finite element analysis; gold; heat conduction; laser beam welding; mechanical strength; metallic thin films; microassembling; nickel; semiconductor device packaging; semiconductor lasers; temperature distribution; Au; Au coating thickness; Au thickness effect; FEM; FeNi; Invar-Invar joints; Ni; Ni coating; finite-element method; joint strength; laser beam penetration; penetration depth; reliable optoelectronic packaging; semiconductor laser packages; thermal conduction; thin Au coating; weld width; Coatings; Conducting materials; Finite element methods; Gold; Laser beams; Optical materials; Semiconductor device packaging; Semiconductor lasers; Thickness measurement; Welding;
fLanguage
English
Journal_Title
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1070-9894
Type
jour
DOI
10.1109/96.641507
Filename
641507
Link To Document