• DocumentCode
    1401374
  • Title

    Effect of Au thickness on laser beam penetration in semiconductor laser packages

  • Author

    Cheng, Wood-Hi ; Wang, Szu-Chun ; Yang, Yi-Dian ; Chi, Sien ; Sheen, Maw-Tyan ; Kuang, Jao-Hwa

  • Author_Institution
    Dept. of Electro.-Opt. Eng., Nat. Sun Yat-Sen Univ., Kaohsiung, Taiwan
  • Volume
    20
  • Issue
    4
  • fYear
    1997
  • fDate
    11/1/1997 12:00:00 AM
  • Firstpage
    396
  • Lastpage
    402
  • Abstract
    Comprehensive measurements of the dependence of the weld width, penetration depth, and joint strength on the Au coating thickness in laser welding techniques for semiconductor laser packages are presented. The results obtained from the Invar-Invar joints show that the welded joints with thick Au coating exhibit narrower weld width, shallower penetration, and hence less joint strength than those the package joints with thin Au coating. A finite-element method (FEM) has been carried out on the effect of Au thickness on laser beam penetration in Invar-Invar joints. This method has been employed successfully to predict the laser beam penetration in laser welded Au-coated materials that the weld width and the penetration depth are reduced as the Au coating thickness increases. The likely cause for the reduction is the increased thermal conduction of thicker Au in the welded region. In addition to Au coating, the effect of Ni coating on laser beam penetration is also presented. Detailed knowledge of the effect of Au coating thickness on laser beam penetration is important for the practical design and fabrication of reliable optoelectronic packaging having laser welded Au-coated materials
  • Keywords
    Invar; finite element analysis; gold; heat conduction; laser beam welding; mechanical strength; metallic thin films; microassembling; nickel; semiconductor device packaging; semiconductor lasers; temperature distribution; Au; Au coating thickness; Au thickness effect; FEM; FeNi; Invar-Invar joints; Ni; Ni coating; finite-element method; joint strength; laser beam penetration; penetration depth; reliable optoelectronic packaging; semiconductor laser packages; thermal conduction; thin Au coating; weld width; Coatings; Conducting materials; Finite element methods; Gold; Laser beams; Optical materials; Semiconductor device packaging; Semiconductor lasers; Thickness measurement; Welding;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1070-9894
  • Type

    jour

  • DOI
    10.1109/96.641507
  • Filename
    641507