DocumentCode
1402118
Title
Power Amplification at 0.65 THz Using InP HEMTs
Author
Radisic, Vesna ; Leong, Kevin M K H ; Mei, Xiaobing ; Sarkozy, Stephen ; Yoshida, Wayne ; Deal, William R.
Author_Institution
Northrop Grumman Aerosp. Syst., Redondo Beach, CA, USA
Volume
60
Issue
3
fYear
2012
fDate
3/1/2012 12:00:00 AM
Firstpage
724
Lastpage
729
Abstract
In this paper, progress toward developing solid-state power-amplifier modules at 0.65 THz is reported. This work is enabled by a >;1 THz fMAX InP HEMT transistor with a 30-nm gate and an integrated circuit process specifically tailored for circuits operating at frequencies approaching 1 THz. The building block of the reported amplifier modules is an eight-stage terahertz monolithic integrated circuit (TMIC) amplifier. The first six stages of the TMIC use 20- transistors, while the final two output stages rely on two power-combined 20-μm transistors to increase the output power. For operation at 0.65 THz, the TMIC also relies on integrated electromagnetic transitions for direct coupling with the WR1.5 waveguide of the amplifier package. Two modules are reported, with the first module containing a single TMIC and demonstrating a peak saturated output power of 1.7 mW at 640 GHz with a measured small-signal gain ≥10 dB from 629 to 638 GHz. The second module features two power-combined TMICs to increase output power. This is done using a waveguide Y-junction as both the combiner and splitter. In test, this power-combined module reached a peak output power of 3 mW at 650 GHz and measured small-signal gain ≥10 dB from 625 to 640 GHz.
Keywords
HEMT integrated circuits; III-V semiconductors; MMIC power amplifiers; coupled circuits; indium compounds; microwave amplifiers; millimetre wave amplifiers; power combiners; HEMT transistor; InP; TMIC amplifier; WR1.5 waveguide; amplifier package; combiner; direct coupling; eight-stage terahertz monolithic integrated circuit amplifier; electromagnetic transition; frequency 0.65 THz; frequency 629 GHz to 638 GHz; frequency 640 GHz; integrated circuit process; power 1.7 mW; power 3 mW; power amplification; power-combined module; size 20 mum; size 30 nm; solid-state power-amplifier module; splitter; waveguide Y-junction; Electromagnetic waveguides; Gain; Indium phosphide; MODFETs; Power generation; Power measurement; HEMT; millimeter wave; power amplifier; solid-state power amplifier (SSPA); sub-millimeter wave; terahertz monolithic integrated circuit (TMIC);
fLanguage
English
Journal_Title
Microwave Theory and Techniques, IEEE Transactions on
Publisher
ieee
ISSN
0018-9480
Type
jour
DOI
10.1109/TMTT.2011.2176503
Filename
6107600
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